Factors Affecting Thermal Conductivity of Thermal Conductive Silica Gel

Thermal conductive silica gel is a kind of thermal conductive medium material synthesized by special process, which is based on silica gel and added with various auxiliary materials such as metal oxides. It is also called thermal conductive silica gel in the industry. The factors affecting the thermal conductivity of thermal conductive silica gel are summarized.


1. Filler shape: Generally speaking, the order of easy formation of heat conduction path is whisker > fibrous > flake > granular. The easier the filler forms heat conduction path, the better the thermal conductivity.


2. The content of filler: The distribution of filler in polymer determines the thermal conductivity of the composites. When the filler content is small, the thermal conductivity is not obvious; when the direction of the heat conduction network chain is consistent with the direction of heat flow, the thermal conductivity is the best. Therefore, there is a critical value for the amount of thermal conductive filler.


3. The bonding characteristics of the interface between filler and base material: the higher the bonding degree between filler and base material, the better the thermal conductivity. The surface treatment of filler with suitable coupling agent can increase the thermal conductivity by 10%~20%.


4. The types and characteristics of polymer matrix materials: the thermal conductivity of matrix materials is very high, the better the dispersion of fillers in matrix and the better the bonding degree between matrix and fillers, the better the thermal conductivity of thermal conductive composites.


5. Types of fillers: The higher the thermal conductivity of fillers, the better the thermal conductivity of thermal conductive composites.


These are the factors that influence the thermal conductivity of thermal conductive silica gel summarized by the editor. If you want to have a deeper understanding of thermal conductive silica gel, our technicians will give you more detailed answers.