What are the advantages of thermal conductive silicone film?

I believe you are not unfamiliar with the thermal conductive silicone film, but we do not know how much you know about the performance advantages of the thermal conductive silicone film? Now the small edition for you to reveal one by one.

The performance advantages of thermal conductive silicone film are as follows:

(1) Scope of thermal conductivity and stability

Thermal conductive silicone film has great selectivity in terms of thermal conductivity, which can be selected from 0.8w/k.m-... More than 3.0w/k.m, and stable performance, long-term reliable use;

At present, the maximum thermal conductivity of the double-sided adhesive is not more than 1.0w/k-m, and the thermal conductivity is not ideal.

Thermal conductive silicone grease is a curing process at room temperature. It is prone to surface cracking, unstable performance, volatilization and flow at high temperature, and its thermal conductivity will gradually decline, which is not conducive to long-term reliable system operation.

(2) Bridging the technological difference in structure, reducing the technological difference requirement of radiator and radiator components

The thickness and hardness of the thermal conductive silicon film can be adjusted according to the design. Therefore, the thermal conductive channel can bridge the difference of heat dissipation structure and chip size, and reduce the difference requirement for the contact surface of the heat dissipation device in the structural design, especially for the flatness and roughness. If the processing accuracy is improved, the cost of the product will be greatly increased. Therefore, the thermal conductive silicon film can be used. In order to fully increase the contact area between the heater and the radiator, the production cost of the radiator is reduced.

In addition to the traditional PC industry, the new heat dissipation scheme is to remove the traditional radiator and unify the structure and radiator into a heat dissipation structure. In PCB layout, heat sinks are laid on the back or on the front, heat sinks are opened around the chips that need heat dissipation, heat is transferred to the back of PCB through copper foil, and then heat conduction channels are built by filling thermal conductive silicone film to guide the heat sinks below or on the side of PCB (metal brackets, metal shells), so as to optimize the overall heat dissipation structure and reduce the overall dispersion. Cost of thermal schemes.